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| Advance Product Information April 27, 2005 3.5GHz WiMAX Driver / Power Amplifier Key Features * * * * * * * * * * TGA2703-SM 3.3-3.8 GHz Bandwidth 41 dBc IMR3 @ 21 dBm Pout/tone 24 dB Nominal Gain 30 dBm Nominal P1dB 2.5% EVM at 22 dBm output power 13 dB step attenuator function Power sample port -1.5V Vg voltage to shut down drain current Self bias: +6 V 770mA Package Dimensions: 5.0 x 5.0 x 0.9 mm QFN Primary Applications * Fixed Broadband Wireless * WiMAX 30 Preliminary Measured Data Bias Conditions: Vd = +6 V Self Bias 25 20 General Description TGA2703-SM is a linear amplifier operating for 802.16 broadband wireless applications in 3.3 to 3.8 GHz frequency band. The PA delivers 24 dB of small-signal gain, 30dBm P1dB and 40 dBc IMR3 at 21 dBm output power per tone from a single +6V power supply. It has 2.5% EVM at 22 dBm output power. The TGA2703 incorporates a 13 dB step attenuator function and a power sampling port. The 50 ohm device requires minimum external components for operation, and is packaged in a low-cost, surface mount 5x5 QFN style package. Lead-Free & RoHS compliant. Demo boards are available. S-Parameter (dB) S21 15 10 5 0 -5 -10 -15 -20 3.3 3.4 3.5 S11 S22 3.6 3.7 3.8 Frequency (GHz) 35 34 Output Power (dBm) 33 32 31 30 29 28 27 26 25 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 Frequency (GHz) P2dB P1dB Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to change without notice. 1 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM TABLE I MAXIMUM RATINGS 1/ SYMBOL Vd Vctrl Id Ig PIN PD TCH TM TSTG 1/ 2/ 3/ 4/ 5/ PARAMETER Drain Voltage Gain Control Voltage Drain Current Gate Current Input Continuous Wave Power Power Dissipation Operating Channel Temperature Mounting Temperature (30 Seconds) Storage Temperature VALUE 7V 7V 1.1 A 6 mA 25 dBm 4.68W 150 C 260 0C -65 to 150 0C 0 NOTES 2/ 2/ 3/ 3/ 2/ 4/ 5/ These ratings represent the maximum operable values for this device. Combinations of supply voltage, supply current, input power, and output power shall not exceed P D. Total current for the device. When operated at this bias condition with a base plate temperature of 85 0C, the median life is reduced. Junction operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. 2 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM TABLE II ELECTRICAL CHARACTERISTICS (Ta = 25 0C Nominal) Notes Response Frequency Band Drain Operating Voltage Small Signal Gain Input Return Loss Output Return Loss Control Gain Step Psat P1dB EVM Gain variation over temperature IMD3 TOI Units GHz V dB dB dB dB dBm dBm % dB/ oC dBc dBm Typical 3.3-3.8GHz 6 24 10 12 13 31.5 30 TBD 0.03 41 42 Pin at 11 dBm at 3.5 GHz, 23 dBm Pout at 21 dBm Pout/tone at 21 dBm Pout/tone TABLE III THERMAL INFORMATION Parameter RJC Thermal Resistance (channel to backside of package) Test Conditions Vd = 6V ID = 0.77 A Pdiss = 4.62 W TCH (oC) 145.5 RTJC (qC/W) 13.1 TM (HRS) 3.8E+6 Note: Package backside soldered to carrier at 85C baseplate temperature. 3 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM Measured Data Bias Conditions: Vd = 6 V, Id =770 mA Self Bias 30 20 S21 S Parameter (dB) 10 0 -10 -20 -30 2 2.5 3 3.5 4 4.5 5 S11 S22 Frequency (GHz) 35 34 Output Power (dBm) 33 32 31 30 29 28 27 26 25 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 Frequency (GHz) P1dB P2dB 4 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM Measured Data Bias Conditions: Vd = 6 V, Id =770 mA Self Bias 35 30 3.2GHz Pout (dBm) 25 20 15 10 -15 -10 -5 0 Pin (dBm) 5 10 15 3.3GHz 3.4GHz 3.5GHz 3.6GHz 3.7GHz 3.8GHz 0 -10 IMR3 (dBc) -20 -30 -40 -50 -60 15 17 19 21 23 25 27 Output Power per Tone (dBm) 3.35GHz 3.4GHz 3.45GHz 3.5GHz 3.55GHz 3.6GHz 3.65GHz 5 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM Measured Data Bias Conditions: Vd = 6 V, Id =770 mA Self Bias 28 24 20 PAE (%) 16 12 8 4 0 -15 -10 -5 0 Pin (dBm) 5 10 15 3.2GHz 3.3GHz 3.4GHz 3.5GHz 3.6GHz 3.7GHz 3.8GHz 1 0.9 0.8 0.7 Id (A) 0.6 0.5 0.4 0.3 0.2 0.1 0 -15 -10 -5 0 Pin (dBm) 5 10 15 3.2GHz 3.3GHZ 3.4GHz 3.5GHz 3.6GHz 3.7GHz 3.8GHz 6 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM Measured Data Bias Conditions: Vd = 6 V, Id =770 mA Self Bias 30 29 28 27 S21 (dB) 26 25 24 23 22 21 20 3 3.1 3.2 3.3 3.4 Frequency (GHz) 3.5 3.6 3.7 3.8 25 degC -40 degC 70 degC OFDM 64 QAM 10 9 8 7 6 5 4 3 2 1 0 14 16 3.35GHz 3.45GHz 3.55GHz 3.65GHz EVM (%) 18 20 22 24 26 Output Power (dBm) 7 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM Package Layout Top View Bottom View 8 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM Package Pinout Diagram 22 28 21 1 GND 15 7 14 8 Top Side Dot indicates Pin 1 Bottom Side Pin 1,2,3 4 5,6,7,8,9 10 11,13 12 15,16,17 Description NC RF Input NC Gain Control NC Gate Acess NC Pin 14 18 19,20,21 22 23,24,25 26 27,28 Description Power Sample RF Output NC Vd2 NC Vd1 NC 9 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM Mechanical Drawing (Bottom Side) 5.00 [0.197] 3.50 [0.138] 5.00 [0.197] 0.31 [0.012] 3.50 [0.138] 0.50 [0.02] Units: mm [Inch] Package tolerance: +/- 0.05 10 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM Recommended Board Layout Assembly 0.01uF 100pF * The evaluation board material is 20 mil thick RO4003 * 100 pF and 0.01 uF are required de-coupling capacitor 11 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703 Bias Connection Self-biased mode 6V TGA2703-SM 4 inch or longer jumper Or 10nH inductor Connect gain control and Vg to ground. Apply +6V to Vd. Current will be ~770mA TGA2703 Bias Connection Gate control mode 6V Vg Connect gain control to ground. Apply negative voltage Vg. Apply +6V to Vd. Current will be ~770mA 12 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM TGA2703 Bias Connection Gain control mode 6V 6V For 13 dB attenuation testing: 4 inch or longer jumper or 10nH inductor Connect gain control to +6V and Vg to ground. Apply +6V to Vd. Current will be ~770mA 20 15 10 S-Parameter (dB) 5 0 -5 -10 -15 -20 -25 -30 3 3.1 3.2 3.3 3.4 Frequency (GHz) 3.5 3.6 3.7 3.8 13 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information April 27, 2005 TGA2703-SM Recommended Surface Mount Package Assembly Proper ESD precautions must be followed while handling packages. Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Clean the assembly with alcohol. Typical Solder Reflow Profiles Reflow Profile Ramp-up Rate Activation Time and Temperature Time above Melting Point Max Peak Temperature Time within 5 C of Peak Temperature Ramp-down Rate SnPb 3 C/sec 60 - 120 sec @ 140 - 160 C 60 - 150 sec 240 C 10 - 20 sec 4 - 6 C/sec Pb Free 3 C/sec 60 - 180 sec @ 150 - 200 C 60 - 150 sec 260 C 10 - 20 sec 4 - 6 C/sec 14 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com |
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